On Tue, Dec 09, 2003 at 11:13:28AM -0600, Melvin Watts wrote:
: 
: Well, we all know that if apple and IBM continue to use the same chip 
: technology, they better reconstruct the design of laptops. . .it just 
: simply comes down to heat transfer. It takes a lot more heat [more than 
: what the chip can generate] to heat the air!!?? So really the problem 
: is air and space in the powerbook design, however, anything is 
: possible. GO FIGURE!!

When you pump a lot of electrons into an electrical system, one of the
by-products is heat.  Too much heat causes irrepairable damage.  The
real problem is adequate heat disappation to keep the electrical system
within its operating parameters so that stuff doesn't melt into a
useless goo.  Most solutions have been with traditional heat sinks:
either blocks of metal to radiate heat away and increase surface area
with the air, or fans to circulate more air to remove more heat from
heat sinks.   But heat sinks have their physical limits (a block of
metal only conducts so much heat) and physical constraints (how much
room do you have in a computer?).  And fans must use electricity to pump
more air (and how loud do you like your fans?).

Now on top of these problems, add the constraints of a smaller form,
limited power supply, and an end-user desire for less noise.  It's not
a trivial problem.  Saying that it's just a matter of getting more air
demonstrates not only a lack of knowledge in the area, but moreso a lack
of respect for difficulty of the problem.  Go figure.


-- 
Eugene Lee
eugene at anime dot net

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