If you compare the heatsinks on the PPC 604 daughtercards or on the G4 
Mac cards with the meager amount of metal on the G3 B&W Rev 1 
processors, you have to wonder if the latter is sufficient to keep a G4 
ZIF upgrade cool.

On the other hand, temperature gauge software says my G4 550 upgrade 
doesn't get hot, nor is the heatsink hot to the touch. And, I've never 
seen after-market heatsinks for G3/4 processors. So, it must not be a 
problem and such system tweaks must not exist.

Right?


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