On Nov 4, 12:16 am, "Tina K." <[email protected]> wrote:
>
> That might not be the case, I do remember some Apple model being
> manufactured with too much thermal paste by mistake, but I don't
> remember which model it was.

that was clearly a manufacturing mistake.  i had a PB G4 1.67 hi-res
model, and the processor burned out.  when i disassembled it, i
discovered that there were gobs and gobs of the thermal paste.  WAY
too much, and that undoubtedly contributed to the failure.  i scraped
chunks off the heatsink and when i replaced the mobo i used the proper
amount, and it is still going strong.

rule of thumb, however little you apply, it is too much.  there isn't
ANYTHING that is better than direct contact.  the thermal paste is
only to fill the microscopic voids between the two surfaces in direct
contact.  cover the entire surface with paste (don't get any over the
edges), then scrape off as much as you can, press together firmly and
then pull it apart, it should appear that there are large areas with
no paste at all.  this is the correct amount.

i don't recall the brand name, but when i used to build high power
solid-state amplifiers where the massive output transistors generated
much more heat than a CPU, we used a white silicone grease.  as
another reader suggested, i would avoid any paste containing metallic
powder, or powdered diamonds, either.  the mere presence of solid
particles in the paste means that it will likely be applied thicker
than it should be.


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