On Sun, Oct 14, 2007 at 11:54:23PM -0400, DJ Delorie wrote:
>
> As usual, I have nothing definite to work on at the code sprint, so
> I'm open to suggestions. So far, I'm thinking of these options:
>
> * Work on the global puller some more
>
> * Work on integrating the layer-types patch
>
> * Documentation
>
> * Add import and wizard HID types
>
> * Multipin support (may need layer types first)
>
Could you please elaorate a bit more? Especially on layer types and
multi-pin. I don't really understand what you mean.
BTW, while I appreciate the fact that the copper pour works
much better on recent versions of PCB (no more leaving
islands), I have one gripe with it, namely that it leaves
oval (or rounded rectangle) openings in the ground planes
around rectangular pads(instead of rectangular ones). The problem
is that the soldermask patterns pads are still rectangular and this
means that the distance between the corners of the soldermask
openings and the remaining copper is much smaller than
with rectangular ground plane openings.
I see two possible solutions:
- revert to rectangular openings in the ground plane
- use rounded rectangles for soldermask around rectangular pads.
Regards,
Gabriel
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