Dan,

See the patch that I posted a couple of days ago that implements this for
PCB. 
I ultimately decided to use (abuse) the nopaste flag so that users can
specify
which pads they want broken up.  If this is to be a permanent solution, we
should
probably add a new flag for this case.

-DC

On Sun, 10 Feb 2008 00:37:45 -0500, Dan McMahill <[EMAIL PROTECTED]> wrote:
> David Carr wrote:
>> I have the distinct (dis)pleasure of making some PCBs with QFN/MLF
> packages
>> that have exposed copper paddles.  I think I'll need to use stencils to
>> properly apply paste for these packages.  It appears that PCB simply
> uses
>> SMT pads (slightly shrunk) as the apertures for the paste layer.  I
> think
>> this is a simple effective design for most packages --- except exposed
>> ground paddles.  These require that the paste be broken into smaller
>> "blocks" with say 75% coverage of the paddle.  (See Analog AN-772)
>>
>> Has anyone on the list dealt with this issue in the past?  If not, I
> wonder
>> if there is any way to distinguish paddle pads from regular ones so that
> I
>> could modify the paste layer code to do the right thing.  I guess we
> could
>> do something like look for square pads with a size > Xmm on a side. 
> That
>> seems a big fragile though.
> 
> That might not be too bad as long as we have a way to specify what X is
> and something about how a large pad should be broken up.  With the
> disclaimer that I'm far from being an expert in the assembly process, it
> would seem to me that you'd probably want to break up essentially all
> larger pads.
> 
> Does anyone know of particular recommendations from IPC for example
> about this?  If there aren't any published recommendations, does anyone
> have contacts at some board assembly houses who could comment on this
> issue?
> 
> -Dan
> 
> 
> 
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