> Sounds reasonable when you allow for extra area, which is also > reasonable for a start on a product with low volume, and afford a > re-layout later.
Right. In the photos, the pads that are "relevent" are larger. > > You wouldn't even need copper on the unused outer layer, you could > > just drill it out. > > What do you mean by that above? What unused? If you're connecting a power layer to the opposite outer layer, just get rid of the near-side outer layer completely. See the last diagram; imagine drilling a hole through the top signal layer big enough that there's no copper left. > > > ----------========== || ==========---------- > > ---------------===== || =====--------------- > > | || | > > ---------------===== || =====--------------- > > ----------========== || ==========---------- > > > This char picture I am confused by -- the outside holes are not larger.... This is for a signal-signal via; the wire goes from one outer layer to the other, and the outer layer pads are larger. > > > > > ----------===== --\\ =====---------- > > ----------========== || ==========---------- > > | || | > > ---------------===== || =====--------------- > > ----------========== || ==========---------- > > \\----- > > > The top half of this I see as larger holes > and a wire put through for connectivity. > > Right? Right. This is a case where the top power layer connects to the bottom signal layer. The top signal layer has an arbitrarily large hole; you'd want something large enough to poke your iron in there to solder. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
