Hi, Looking at the PCB docs it seems like SMD pads must either be round or rectangular, never both? I'm just looking at the recommended land pattern in this data sheet (PDF, page before last page):
http://www.ti.com/lit/gpn/bq24070 They'r drawing longish pads which are round on one end and rectangular at the other end. Also the die-attach pad has a very unusual complex polygonal form. What's the right way to define such a footprint (preferably oldlib-style)? Add some additional copper polygons around the pad?? Or overlap multiple pads with the same name/number? Or just make all pads rectangular and hope that reflow soldering still works? Being very new to PCB layouting I have no clue :) Thanks for any help, best regards, David -- GnuPG public key: http://user.cs.tu-berlin.de/~dvdkhlng/dk.gpg Fingerprint: B17A DC95 D293 657B 4205 D016 7DEF 5323 C174 7D40 _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
