I think that this is a non-issue. I have built bords with these types of vias in pads many times. Thermal shielding is more of an issue when you are attempting to attach a device to a pad. In that case, you don't want a via connecting directly to a large ground or power plane without thermal relief as the plane would transfer and disipate the soldering heat.
Steve Meier On Thu, 2007-01-11 at 23:52 +0100, David Kuehling wrote: > Hi, > > I just noticed that punching a via into a large ground pad does not > produce a non-copper (clearance) ring around the via, as it would do for > vias inside polygons, see screenshot: > > http://user.cs.tu-berlin.de/~dvdkhlng/via-in-pad.png > > I guess such kind of via wouldn't be manufacturable since it isn't > thermally shielded from the surrounding pad? > > Or is it just a bad idea to connect die-attach-pads directly with vias? > > David _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
