> You have to control the access of the etchant to the metal. Maybe a > dithered fuzz of toner around the edge of the hole would allow the > center more access to etchant so you could go through before > exposing as much edge. Eventually the isolated dots would just fall > off as the surrounding metal was eaten away.
The pitting indicates that any tiny hole, no matter how fine my dithering, results in a cone shaped pit. Think about it - if the etchant can get to the other side, which is 5 mils away, it can certainly get sideways the same amount through the same hole. Since the holes I'm trying to make are only 10 mils across, > I'm wondering if you use a scalloped hole like that, if the "bowl" > of solder paste will actually be peeled off by the lip all around > the edge. You almost need to etch it from the board side so that > the opening "faces" downward. The idea was always to have the "toner" side down, so that it releases the paste easier. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
