DJ Delorie wrote: The
best part was, you get through-vias for free because of the way you do the drilling.
Free always sounds good... still messier than ink jetting around.... And the ink jetting has just been proven out some. I bet, with just a trace to trace connection overlap area, using the silver-nitrate/ascorbic-acid ink jet method, you could lay down a "topology layer", reduce it to silver metal, lay down insulating paint, cure it, prep the overlap areas so they take new ink jetting conductively, and lay down a second "topology layer" that can cross over the first, reduce it to silver, cover with insulating mask, cure. Without any holes at all, you could do multi layers. Silver's high conductive. You could do RF. John Griessen _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
