> a) pcb paste layer gerber is directly from the pad layer, and I > think in many cases that lays down too much solder. I haven't > experimented enough to be able to say for sure. I'd like to see > some paste layer control added to the footprint definition.
I have a post-processor that sets the paste based on the footprint (name and pad; some footprints get paste pushed out, some are centered, etc). But yeah, at some point we need to modify the footprint data structure to have independent paste/mask control. > b) My current method for prepping a file for the laser cutter is a bit > of a kludge. Ideally, I'd like to see the gerber previewer have the > option of exporting .dxf of the pad outlines from the paste layer. If you can provide a format that's ideal for your tooling, plus the rules for tweaking, we can write a custom exporter for it. > And then there are issues of how tightly the laser cutter is adjusted > and how it is focused. I was thinking of this number. Pololu uses 3mil mylar, and specify a 10mil minimum hole size. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
