Hi all, Was this revolutionary technology introduced on, or around, April 1st ?
And some weeks later withdrawn ?? That doesn't sound odd to me ;-) Kind regards, Bert Timmerman. On Sat, 2007-10-20 at 06:40 -0400, Bob Paddock wrote: > On Thursday 18 October 2007 08:39:00 pm Steve Meier wrote: > > > Via in pad is possible with PCB, micro-vias arn't yet. To avoid the > > wicking or chimeny effect have the back of the board coated with an > > epoxy material prior to assembly this prevents the heat from shooting up > > the via and then sucking the solder down. > > Not directly related to solving that problem but this came to mind: > > "The Bleeding Edge: Inventing the 'VSHDIHTLCTEHF' Microcircuit" > > "Sierra Micro Electronics has just completed six months of R&D on an exciting > new technology: a Very Small, HDI, High-Thermal, Low CTE, High-Frequency > (VSHDIHTLCTEHF) microcircuit." > > However it has been removed from pcb007's archives. Odd. > > It is still in the Google Cache if you do a search for > "VSHDIHTLCTEHF", via Google. > > "We invented ZIG ZAG microvias to enable the position of the through-holes in > the core to be moved around from the original fixed BGA pitch on the top > layer to increase spacing. ZIG ZAG microvias allow each layer of stacked > microvias to move a bit sideways. Over four layers you can move a microvia > about 5–7 mils sideways, which is enough to move the core drill position to > create a thicker web between drill locations on the core." > > > > _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
