> 2) If the thermal tool is used on a via that's not touching a pad, > you get a solid connection by default (currently the last of several > options available if you shift-click with the thermal tool).
I like this. I set them all up that way anyway, having it as the default would save me some time. Of course, that assumes you're having a fab make the board. If I were doing vias with home-etch, I'd need to solder them, so the current default would make more sense. > I was also thinking it would be clever to have a way to place a via > that's connected to the current layer. Eg if you shift-click to > place a via, it's connected to the current layer, just like if you'd > switched to the thermal tool and clicked once (with an eye toward > using those new rule above as well). When I'm doing this type of thing, the ground plane is usually not my current layer. I work on a signal layer to run the traces, place the vias, and then go around thermalling them all to the right planes. I think expanding on the auto-thermal idea would be better. Place traces and vias, hit a magic key, and all the vias thermal to the right layers/polygons according to the netlist. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
