Hi all, I have the notion that according to the IPC the abbreviation (or general suffix) _HS should stand for Heat Sink requiring additional holes or pads.
Kind regards, Bert Timmerman. On Tue, 2007-11-20 at 16:18 -0500, Steven Michalske wrote: > When i have made hand soldering pads for QFP with the center pad I > used the HS for hand solder, because it is not truly the M for maximum > and would conflict with a true JEDEC M > > my QFP with pad hand solder has a pin placed in the center of the pad > to allow for applying heat through the via and to solder the back of > the part. > > Steve > > On Nov 20, 2007 1:51 PM, Stefan Salewski <[EMAIL PROTECTED]> wrote: > > Hello, > > > > some footprint outlines suggested by manufactures are only useful for > > automatic hot air soldering (ie. DFN14 of LTC4088 from Linear). > > > > For hand soldering extended pads are necessary -- so I will create two > > versions. > > > > How should I name the official (manufacturer) and the extended > > footprints? > > > > PartName.fp (size as spezified in datasheet) > > PartName_ext.fp (extended) > > PartName_ext10.fp (each pad extended by 10mil) > > PartName_hs.fp (hand soldering) > > > > ? > > > > Best regards > > > > Stefan Salewski > > > > > > > > > > > > > > _______________________________________________ > > geda-user mailing list > > [email protected] > > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > > > > > _______________________________________________ > geda-user mailing list > [email protected] > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
