I've seen how some are thinking about the notion of layer stacks for vias with holes, and I am pondering no-hole layer stacks to use with conductive ink jumper layers that are all additive, so need no drill holes. What are these called? Bond pads? What else would you call them, since bond pads reminds you of wire bonding?
Would conceptual layer stacks be associable with a pcb via, or also with a pad? Or will they be something we can give a name for any specific use, such as microvia, blind-via, conductive-ink-connection-pad? A via that has a zero hole size might be useful for the case of conductive ink jumpers, since that lets you have a non component place where you go from one layer to another, even without a hole... You want the layer connectivity information in the same way as with via thru-holes for matching a netlist. Meanwhile, using pcb as it is... How do you make a zero hole-sized via? This really needs to be a different named object, so DRCs can be done on them like, verify layer to layer connectivity such that every layer stack with this conductive ink pad in it has all the adjoining layers it needs overlapping here, or no connectivity. Also you could make a DRC to warn that shorts will happen if the insulation layer is omitted. ChangeDrillSize(SelectedObjects,10,mil) makes a change, but, ChangeDrillSize(SelectedObjects,0,mil) is ignored by pcb. John Griessen -- Ecosensory Austin TX _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
