Here's something to think about from IPC-2514A.pdf
(titled: Sectional Requirements for Implementation of Printed
Board Fabrication Data Description [BDFAB])

  Need Identifier             Keyword/Section                   Keyword Usage
Drill data              HOLEREF                     Associated with padstacks
X-Y location            <position>, <xy_ref>,       Last parameter for drawables
                         <location>,.<placement>
Diameter                HOLEDEF.<primitive_ref>     Used for lands in padstacks
Hole type (NPTH or PTH) HOLEDEF.<hole_type>         Defines hole type
Layer association       HOLEDEF.<layers_ref>        Identifies layer order and 
type
Tooling holes           HOLEDEF.<hole_type>         Hole-type (tooling)
Hole usage              HOLEDEF.<hole_type>         Describes conductors and 
vias
Conductor definition    ROUTES                      Describes conductors and 
vias
Layer                   LAYERS                      Conductive and 
non-conductive layers
Line end                LINEDESC.<line_end>         Defines line ends
Conductor               ROUTES                      Path and plane conductors
Land                    PATTERNDEF                  Collections of pads drawn 
in components
Card outline                 OUTLINE                         Physical outline 
of the board or panel
Cutouts                      CUTOUT                          Part of BOARD, 
PANEL, and FIXTURE
                                                              definition
Notches                      GROOVE                          Part of BOARD, 
PANEL, and FIXTURE
                                                              definition
Milled thickness             WELL                            Part of BOARD, 
PANEL, and FIXTURE
                                                              definition
Special features             FEATURE                         Specialized artwork
Fiducials                    TARGET                          A special artwork 
used for alignment (standard)
Bad board marks              TARGET                          User-defined 
primitive
Legend                       TEXT                            Text primitives 
(text box)
Reference designators        TEXT                            Text primitives 
(text box)
U.L. rating symbol           LOGO                            User-defined 
primitive
Logos                        LOGO                            User-defined 
primitive
Part numbers, etc            BOARD.<board_number>            Can be drawn using 
Text primitives (text box)
Datum features               TARGET                          Target (standard 
primitive)
Panelization                 OUTLINE, GROOVE                 xy reference
Global fiducials             TARGET                          A special artwork 
used for alignment (standard)
Non-conductor definition     LAYERSINGLE.<GenCAM_layer_type> DIELBASE, 
DIELCORE, or DIELPREG
Solder mask                  LAYERSINGLE.<GenCAM_layer_type> SOLDERMASK
Layer sequence               LAYERSINGLE, LAYERSET           Layer set name 
followed by 1 to "n" layers
Dielectric thickness and     LAYERSINGLE.<thickness>,        Part of parameters 
for layer type
materials                    LAYERSINGLE.<material>
Copper weights and materials LAYERSINGLE.<material_code>     Part of layer 
description
Finish                       LAYERSINGLE.<GenCAM_layer_type> COATINGCOND or 
COATINGNONCOND
Overall thickness            LAYERSET.<thickness>            Desired finished 
thickness of the layerset


We could use the names from the international standard, and that would ease 
translations
to and from XML versions of data...or be a starting point for someone 
XML-minded to make plugins
to gschem, pcb, gerbv...  Not me...

John G

-- 
Ecosensory   Austin TX
tinyOS devel on:  ubuntu Linux;   tinyOS v2.0.2;   telosb ecosens1


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