> Question 1: Each "Group" will be a physical layer of copper, correct?
Yes. > Question 2: In this a reasonable assignment, or am I missing something? That's the stackup I use. In general, you want the ground plan near the signal plane with the most signals. For surface mount, that's the top. For through-hole it might be the bottom. > Question 3: I'm assuming the best way to make the power and ground > layers are to simply flood-fill them with copper, and then the > components will attach by the pin connections. Is it really just > that easy? Yes. Draw a rectangle keeping 25 mil away from your board outlines, then use the thermal tool to connect pins to it as needed. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
