On Mon, May 5, 2008 at 10:24 AM, James Moody <[EMAIL PROTECTED]> wrote: > > Speaking of placement, can you give me a few pointers on spacing of > components? For example, if I have a few DIP sockets side by side, what > is the closest practical placement assuming trace routing is not an > issue? How about for placing resistors (R025 footprint)? The default > grid is 10 mils -- does it make sense to increase this to, say, 50 mils > for placing components then return to 10 for placing traces? I am not > using surface mount devices on this project.
In general --- for TH components I would place on a 50mil grid and route on a 25mil grid. For SMD I would place on a 25mil grid and route on a 10mil grid. For spacing 1/4W resistors I would do 50mils mininum. 100mils is generous and should be very easy to assemble. What you may want to do is 1:1 printout. Place the components on the paper and see if it works for assembly process. If your using the silkscreen body outline as a placement guide make sure it matches your components ;-) (* jcl *) -- http://www.luciani.org _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
