Hi, I recently applied ground flooding to the component side of a PCB design. Unfortunately, flooding 0603 components results in a thin copper "hair" in between the pads, that is less than 6 mil and thus violates design rules. Here is a screenshot that illustrates the problem:
http://mosquito.dyndns.tv/~spock/pcb-groundflood.png The other problem is, that the DRC does _not_ detect the problem. I could manually work around those problems by keeping ground flood away from 0603 components, but without help of the DRC I'm afraid I might overlook some problematic spots... How do you do ground flooding in PCB? The simple example file is available here: http://mosquito.dyndns.tv/~spock/pcb-groundflood.pcb Tested with pcb from SVN (few days old). David -- GnuPG public key: http://user.cs.tu-berlin.de/~dvdkhlng/dk.gpg Fingerprint: B17A DC95 D293 657B 4205 D016 7DEF 5323 C174 7D40 _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
