On Thu, Nov 13, 2008 at 1:45 PM, Ethan Swint <[EMAIL PROTECTED]> wrote:
> do the TI footprints that involve thermal pads fall within the > IPC definitions? I have a few of the TI footprints with thermal pads at luciani.org --- HTSSOP-65P-810L1-28N-420LT-770WT__TI_PowerPAD_Package HTSSOP-65P-810L1-30N-420LT-900WT__TI_PowerPAD_Package HTSSOP-65P-810L1-32N-420LT-900WT__TI_PowerPAD_Package HTSSOP-65P-810L1-38N-420LT-1050WT__TI_PowerPAD_Package SON-50P-380L1-10N-240WT-165LT__TI_DRC_Package.fp SON-50P-380L1-10N-240WT-165LT__TI_DRC_Package.sfp (stencil footprint) SON-65P-280L1-6N-160WT-100LT__TI_DRV_Package.fp SON-65P-380L1-8N-240WT-150LT__TI_DRB_Package.fp (* jcl *) -- http://www.luciani.org _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
