Be careful mounting a part like this upside down. If the back side pad on the part is critical to grounding or heat removal (like some switching power supply controllers) you could easily cause the part to malfunction or worse yet, fail altogether. Joe T
On Tue, Apr 28, 2009 at 12:15 PM, William Estrada <[1][email protected]> wrote: Use a plcc adapter. Or use the dead bug design, glue it upside down to a piece of plastic then solder the wires to the chip. > Message: 11 > Date: Mon, 27 Apr 2009 22:55:17 -0500 > From: Bill Gatliff <[2][email protected]> > Subject: gEDA-user: OT: soldering QFN packages with exposed bottom > pad? > To: gEDA user mailing list <[3][email protected]> > Message-ID: <[4][email protected]> > Content-Type: text/plain; charset=ISO-8859-1; format=flowed > > Guys: > > Got any recommendations for how to hand-solder a QFN package that has an > exposed bottom pad? At the moment, all I have is a soldering iron. > > Do you think I could just put a plated-through via underneath the pad, > and then flow solder through that from the back side? > > > b.g. > > -- Bill Gatliff [5][email protected] -- William Estrada [6][email protected] Mt-Umunhum-Wireless.net ( [7]http://64.124.13.3 ) Ymessenger: MrUmunhum _______________________________________________ geda-user mailing list [8][email protected] [9]http://www.seul.org/cgi-bin/mailman/listinfo/geda-user References 1. mailto:[email protected] 2. mailto:[email protected] 3. mailto:[email protected] 4. mailto:[email protected] 5. mailto:[email protected] 6. mailto:[email protected] 7. http://64.124.13.3/ 8. mailto:[email protected] 9. http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
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