Bob Paddock wrote: > Our CM got a ten minute rant from one of the Big Name Solder > Vendors when they were asked that question. After ten minutes > our CM knew all of the evils of QFN packages, such as being > almost impossible to clean under (don't use QFN packages in > high impedance circuits, which is giving us fits right now, > due to poor cleaning), but still the Big Name Solder Vendor did not answer > the question as to what *should* be used.
So BGA packages wash out underneath effectively? John -- Ecosensory Austin TX _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
