On Thu, 21 May 2009 16:46:12 +0000, Michael Sokolov wrote: > Additional documentation:
> http://ifctfvax.Harhan.ORG/OpenSDSL/OSDCU/OSDCU_schem.ps > A bill of material (BOM) woud help to estimate the necessary effort. The BOM should include the package of the parts, especially of the connectors and special ICs. So it can be seen whether or not all footprints are available in the existing pcb libs. Maximum PCB size matters. An otherwise unspectacular layout task can get really nasty if the maximum allowed size is below a certain threshold. Again, a BOM would help to estimate. If cost is a factor, why not aim for four layers but slightly larger size? ---<(kaimartin)>--- _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
