On Mon, May 25, 2009 at 06:33:01PM -0400, DJ Delorie wrote: > > Vias connect the two sides, so you can test for connectivity. That's > all I was thinking. If connectivity can be done another way, then you > have other options.
What about using lines+arcs on the solder layer to represent the wiring of the breadboard? Placing through-hole parts would then connect fine to the lines/arcs on the solder layer, IMHO. The (black) paths would then be routed on the component layer. That way no special footprints would be needed and even DRC might be possible. The only drawback I see with this approach is that paths along the breadboard paths would be doubled: one goes on solder, the other on component side. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
