On Fri, 2009-07-17 at 17:04 -0400, DJ Delorie wrote: > The only bug I know of involves moving thermals on vias to the new > layers. You could build the latest git version just for this > operation.
OK, now I remember the old bug: http://www.geda.seul.org/mailinglist/geda-user92/msg00121.html I guess it is fixed for version 20081128. > > Of course, save a backup copy of your board *anyway*. > > Sure -- but some bugs may hide itself, maybe until gerber export. To be safe I may export gerbers before and after I insert new layers and compare the gerbers. But of course the gerbers may be identical, while PCB operation fails after insertion of new layers. It's a dangerous world... _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
