We want to do powered burn in of populated boards, to catch bad solders and early component failures. I'm thinking 0-65C.
Chris. > Message: 5 > Date: Thu, 15 Oct 2009 19:50:13 -0400 > From: Bob Paddock <[email protected]> > Subject: Re: gEDA-user: PCB burn in spec? > To: gEDA user mailing list <[email protected]> > Message-ID: > <[email protected]> > Content-Type: text/plain; charset=ISO-8859-1 > > On Wed, Oct 14, 2009 at 3:05 PM, Ellec, Chris > <[email protected]> wrote: > > > > Can somebody recommends burn in spec. for PCB such as time vs. > > temperature? Is there a mil spec for that? I could only > find mil-spec > > for burning in individual IC, not PCB (mil-std-883 for example). > > Unpopulated boards? > > Populated boards with or without power while being burned in? > > What is the actual goal you want by doing burn in? > > What we did for populated, unpowered, boards was 65'C for 24 hours, > then into a -20'F freezer for 24 hours, for four cycles of > that, when we > wanted to thermal cycle solder joints. Don't know if there was spec, > it was what someone came up with at the CM I worked. > > > _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
