On Fri, 2009-10-23 at 17:36 -0400, Mark wrote: > On Fri October 23 2009 11:45:29 am Peter Clifton wrote: > > > > I bet it wouldn't be _that_ hard to add supports for pad thermals - > > assuming the pad is rectangular. I've just checked, and noted that some > > of our existing thermal styles don't work so well when the pin is > > octagonal. (That's another little known PCB flag): > > Hm, I wonder about that. When I look at a board with the GL_3D I can see > that the pads have a > different Z-depth than the component layer. Is that something you chose to > do or is there actually > a difference?
Just something I chose to do - probably in error. I was checking the draw routines worked on all layers, so a gap helped me check. The latest visualisation I was playing with dropped any extra depth for the surface pads / pins, keeping them on the top copped / bottom layers - just adjusting their drawn colour to be the "pad" colour, rather than the layer colour. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
