On Sun, 2010-02-07 at 08:04 -0800, Ben Jackson wrote: > On Sun, Feb 07, 2010 at 09:18:35AM -0500, gene glick wrote: > > I made a polygon on the top layer, and I want to place a component pad > > within the polygon. Is there a way to make it connect without adding a > > trace? By default the tool places a clearance gap around the pad - so > > it doesn't touch. > > Are you sure you want 100% connection like the other reply suggested? > That can be very hard to solder, especially on a multilayer board where > the top is well "stitched" to internal ground layers. I really think > pads should have the same "thermal" feature that pins do, but since they > don't I just draw lines and set *them* to merge with the poly. If I want > low impedence I just make a "+" of wires.
I would typically use the solid connection for things like a bolt-down transistor, or other heat-sink type connections - although soldering would be a pain, probably requiring pre-heat and reflow. I kind of assumed you were working with a transistor of some kind. For 0.01 Ohm sensing, you probably want to attempt at making a kelvin connection, see http://www.edn.com/article/CA502424.html Specifically, look at the component footprints suggested in Figure 2. Article in PDF format: http://www.edn.com/contents/images/21705di.pdf Best regards, Peter C. _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
