Specifically, the solder balls on the part are to provide some space
between the part and the board. The solder paste is as large as the
pad and makes sure the full pad is wet with solder and completes the
connection.
Rick
At 04:23 AM 11/18/2010, you wrote:
Hi all,
I'd like to ask if solder-paste is necessary for BGAs. The BGA already has
some tin, so the solder-paste on the pad wold be a bad idea.
Do I miss something?
Thanks,
Levente
--
Kovacs Levente <[email protected]>
Voice: +36705071002
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