On Thu, Nov 18, 2010 at 10:01 PM, kai-martin knaak <[email protected]> wrote: > > Looks like there is no open 3D exchange format that fits the > need of pcb: > > a) render a beautiful image of a populated board > > b) integrate pcb in a 3D work-flow to fit the board into some > tight space. > > The existing formats are either limited to surfaces rather than objects > (STL, VRML). This prevents efficient processing of the 3D geometry. > Or they lack attributes for eye candy (IGES). Or they are overly > complex and geared to completely different use cases (STEP) Not knowing anything of which I speak (write?), would COLLADA (https://collada.org/mediawiki/index.php/COLLADA_-_Digital_Asset_and_FX_Exchange_Schema) fit the bill? I just happened to stumble across it last week on something totally unrelated, and then noticed your email saying "I need an open 3D exchange format."
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