The IPC-2222 table of contents shows that "Thermal Relief in Conductor Planes" gets only one tenth of a page. I can't imagine any detailed information in that space. It's sister document, IPC-2221, can be found for free at http://www.victronics.cl/Inf_tecnica/Notas%20de%20aplicacion/PCBs/IPC-2221(L).pdf . IPC-2221 has a section on thermal relief, but without any useful details.
On Sun, Jan 30, 2011 at 2:20 PM, Peter Clifton <[email protected]> wrote: > On Sun, 2011-01-30 at 20:39 +0000, Peter Clifton wrote: >> I've been looking at some brokenness with our normal thermal shape >> generation recently, so if I get a chance I could look at your patch - >> and possibly work from it. > > The only reference to geometry I've found so far is: > > http://www.pcbwizards.com/Glossary20.htm > > And IPC-2222. (Which I don't have a copy of). > > Anyone have access to a copy? > > -- > Peter Clifton > > Electrical Engineering Division, > Engineering Department, > University of Cambridge, > 9, JJ Thomson Avenue, > Cambridge > CB3 0FA > > Tel: +44 (0)7729 980173 - (No signal in the lab!) > Tel: +44 (0)1223 748328 - (Shared lab phone, ask for me) > > > > _______________________________________________ > geda-user mailing list > [email protected] > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > > _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
