Hi. The solder paste pattern emitted by PCB seems to coincide exactly with the copper of the pads. This is a reasonable default. But there are use cases where a different solder paste size is better.
1) A pad completely covered with solder mask should not receive any solder paste. This kind of pads are useful a way to achieve tracks in footprints. 2) Pads partly covered by solder mask should receive a solder mask pillow that corresponds to the hole in the mask, rather than to the pads copper dimensions. Such partly covered pads are useful as a heat sink. 3) If large and small sized SMD parts are combined on the same board, it may be desirable to reduce the size of the solder paste pillows for the smaller footprints. Is there a way to achieve these goals? ---<)kaimartin(>--- -- Kai-Martin Knaak Email: [email protected] Öffentlicher PGP-Schlüssel: http://pool.sks-keyservers.net:11371/pks/lookup?search=0x6C0B9F53 _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
