On Sun, 23 May 2004 11:32:14 -0400 Bob Paddock <[EMAIL PROTECTED]> wrote:
> On Sunday 23 May 2004 10:14 am, Stephen Meier wrote: > > > Look at my document www.meierrippin.com/pcb_landpattern_design.pdf > > I have done so, does it needed updated to reflect the high resultion version > of PCB from CVS? No. > My ~gEDA/0805 footprint looks like this, which has a lot more zeros than your > examples: > > Element[0x00000000 "0805" "R104" "10k" 197500 35000 -27500 -2500 0 100 > 0x00000000] > ( > Pad[-1700 -3200 1700 -3200 3600 3000 3600 "1" "1" 0x00000100] -1700: x1 -3200: y1 1700: x2 -3200: y2 3600: 36 mil thickness, analgous to pin diameter 3000: 30 mil clearance from any polygon 3600: 36 mil solder mask, same size as pad Note that the solder mask is the same size as the pad. Turn off the pins/pads to see the mask or produce a gerber file and view it. The last time I had a board done the fab shop required at least a 3 mil "solder mask relief". The above definition has no solder mask relief as the mask is the same size as the pad. I started developing scripts to change the relief to 3 mil on all elements but haven't completed it yet. Maybe there is a better way. <snip> David
