On Fri, Dec 31, 2004 at 01:19:38PM -0500, M. P. Dickens wrote: > FWIW, I deal with bga parts a lot. I'v tried several methods including > hot air and all of them with the exception of one have been problematic. > With hot air, you run the risk that the part will be moved as the air > blows on the part and the solder paste begins to melt. Also, heating a > board with hot air can seperate the layers in the board because > typically, one one side of the board is heated and the other side is not > (And stays cooler). > > Anyway, the method I use give about a 95% success rate on high pitch, > high ball count parts. The success rate is close to 100% with low ball > count parts. > > The setup I use consists of two dark IR heating elements. One is placed
What is dark IR? I know what IR is but don't know what a dark IR is. Cl<
