Why the PCB data files have copper-to-copper clearance expressed in copper-to-copper clearance and soldermask-copper clearance in mask diameter or width and not also in copper-mask clearance? It seems illogical to me.
And what is typical for the manufacturing process is the copper-mask clearance and not mask diameter, which is changing with each change of copper width or pin diameter. What is even confusing to the user is the fact that after ChangeClearSize(SelectedPads, 14, mil) the "Object report" says "Clearance width in polygons 6.99 mils" I would at least expect the number fed into user commands be the same as reported. No, reported numbers may be multiplied by a random factor F where F=G/H, where G and H are small natural numbers Cl<
