On Fri, Jan 07, 2005 at 05:58:10AM -0500, Bob Paddock wrote: > On Friday 07 January 2005 01:57 am, Stephen Meier wrote: > > I feal like I have to step in here. With a 900 pin BGA (30 rows by 30 > > columns) at a 1mm (39 mil) pitch. Four signal layers are just bearly > > able to route all the signals out from under the bga. That was using via > > in pad and squeezing two 4 mil traces between pads/layer. > > I know you can not post the design, but could you post the section relevant > to > the BGA? I'd like to know how to do these large BGA's myself. > > Via "via in pad" does that mean each ball falls into a via, or are the balls > on non-hole pads?
Is putting vias through SMD pads a bad practice? Can it influence reliability of the soldering? Cl<
