[ Ales here, I'm reposting this since majordomo didn't recognize the e-mail as being subscribed to the geda-dev/geda-user mailinglist. ]
-- Cut here -- From: Marvin Dickens <[EMAIL PROTECTED]> Date: Sat, 8 Jan 2005 00:33:35 -0500 Typically, vias are are in front of the pad or behind it under the chip or chip leg. Most are at an angle to the pad. Putting the via on an smd pad affects rework and manufacture. The pad is easier to pull up off of the board (more like a warp caused by heat than a pull-up). Best regards Marvin Dickens On Friday 07 January 2005 06:16, Karel Kulhavy wrote: > Is putting vias through SMD pads a bad practice? Can it influence > reliability of the soldering? > > Cl<
