> - thermal spoke width is tied to the annular ring of the pad. I > think it is done to avoid funny bumps inside the drill area. But > the effect is the thermals on the top left via are not so hot when > compared to the lower left via
Thermal scale is currently board-level but we could override it with some new variables in the pad struct, plus GUI support. > Also the upper right via has 2 spokes going basically nowhere. We've talked about this before, I proposed options to allow the user to change the thermals from X to + or other configurations, including "none" and "solid". Again, we'd need another variable in the pad struct, plus GUI support. As for the polygons, what we need is a generic poly-cutting routine that results in more edges (or more polys) and NO clears needed. Then, we can analyze the resulting polygons for acute angles, islands, etc. Unfortunately, we'd need to keep the original polygons too, and do the cutting and isolating in near-real-time. Hard job.
