On Monday 24 April 2006 08:02, Marvin Dickens wrote: > > Those jobs that require a highly reactive flux, we use no-clean solder. > These days, that would be repair work involving pin and hole. The > residue is absolutely non-hydroscopic and it has been shown that > statistically it does not promote the growth of tin whiskers (Or any > other type of whisker...). You don't have to clean > it - You leave it on.
But don't use no-clean solder on analog boards with high impedances. We found out the hard way that you will have to go back and clean off the no-clean flux if you do. We have also seen a drop in static operating current by switching to a water-based flux. I am now a big fan. Regards, Daniel
