?lvaro Lopes wrote: > How are we to use those layers ? Which will be mostly ground, vcc, and > routing ?
I was thinking of something like this (assuming six layers): - TOP (LCM side): components, local routing, and test pads - L1: power (routing if necessary) - L2: ground (less strict) - L3: routing - L4: ground (strict) - BOTTOM (battery side): components and local routing That way, we can "sandwich" EMI-sensitive traces between ground planes in layer 3. But ... I've never designed a multilayer board myself, let alone one with RF subsystems, so my ideas may be totally wrong. > Shall we use OM approach ? Hmm, what would that be ? > I also think we can do it with a 6-layer, as long as we can use > buried and blind vias. Blind vias should be no problem. I would try to avoid buried vias if we can. Not only because they may make the board harder to manufacture, but also because they effectively hide a trace from measurements. - Werner _______________________________________________ gta02-core mailing list [email protected] https://lists.openmoko.org/mailman/listinfo/gta02-core
