Rene Harder wrote: > If I'm not completely off we should end up with a trace width around > 8-15mil (50Ohms).
I think so, but will depend on insulator layers and how we chose the ground layers too. But yes. > It's not about the handling, It's more related to the cost. Someone has > to setup the assembly machine (change reels, setup placements etc.) and > if you have a lot of different components you will increase these setup > costs. However for a full production series that should not be a big > issue because this will be a one time fee averaged over all boards but > for a small prototype series this will probably be the main part of the > costs. Understood. > Microvias are even worse then buried or blind vias those requires > special equipment for the fab (laser drills) and a quite complicated > process. > So i would rather use blind or buried vias! Although microvias will make > our live easier then we can embed them into the BGA pads. That was the idea, yes, but we can live without that for the first prototypes. > all holes are platted through and not tented or filled with anything. I read something about filling them here [1]. Hence the question. > I doubt that anyone can design a product without prototyping and > honestly, I believe that this one will not be the last one for gta02-core. It's just a prototype for now, we want to rule the world, so surely we'll improve the design quite a few times :) Best, Álvaro [1] http://www.abraci.org.br/arquivos/ViainPadandPlanarizationTechnologyof24-07-2008.pdf _______________________________________________ gta02-core mailing list [email protected] https://lists.openmoko.org/mailman/listinfo/gta02-core
