While fiddling with fped, I noticed that we have quite a few footprints with silk screen drawings over copper pads:
DFBM-CS320 EXC24C FA2012 FH23-39S-0.3SHW LIS302DL miniUSB_B SC70-5 SC89-6 SON1408-3 SOT23-5 VSSOP8 TDFN34-16 TSOP-6 WM8753FL KiCad will take this "as is" and not make holes in the silk screen for the pads. It's anyone's guess what a PCB maker will make with it. These conflicting drawings in general show the package outline, which is also useful information, but this is something that would better go into a 3D package drawing. It may actually be possible to automatically generate some 2.5D package drawings from the information in fped without too much effort. I need to think about this some more. Fun KiCad problems found along the way: - I'm getting thin (1 mil) silk lines around pads. I never noticed this before. Not sure yet if it's a quirk of our setup or a general bug in KiCad. - when viewing our board in 3D, the arcs come out all wrong. But the result actually looks quite beautiful :-) By the way, the next time you update fped, please rebuild it with make clean all I changed the way the icons are converted and this is not a change the make dependencies can detect. With the old XPMs, fped should still work but will look slightly uglier. - Werner _______________________________________________ gta02-core mailing list [email protected] https://lists.openmoko.org/mailman/listinfo/gta02-core
