Well, yes, it sounds like it to me, but I do accept that 'ball' mounted
devices are different the 'flowed' devices.
I accept that 'flowed' devices where/are already placed into the 'plane'
before the flow.
I suspect that 'ball' devices are handled differently.
JMHO.
Duncan
On 03/27/2013 18:23, Thane Sherrington wrote:
I hadn't heard these terms until today. Are they as much BS, as I
take them to be? It sounds sort of moronic to refer to replacing the
solder on chips as "reballing". Isn't this really a cold solder issue?
T
