On Mon, Dec 09, 2019 at 12:36:38PM -0500, Phil Smith III wrote: > https://hackaday.com/2019/12/08/the-barn-find-ibm-360-comes-home/ > sparked a discussion on a private list about air- and > water-cooling. I'm quite sure that the /44 and /75 we had at > UofWaterloo were air-cooled, because we had no water. (That was one > of the motivations for VM SSI, because we couldn't go bigger than > the 4300s: we had four 4341s in an SSI configuration.) > > > > But nobody could remember (or find definitive doc) on which, if any, > 360s were water-cooled. Someone suggested the /91 was.
I vaguely recall reading about some "computing center" operating sometime in 1960-1980 period, which was water cooled and the heat exchangers pumped warm water into nearby swimming pool. But I am not sure, maybe my mind is making this up. Besides, from this page: https://en.wikipedia.org/wiki/Computer_cooling (quotation start) Starting in 1965, IBM and other manufacturers of mainframe computers sponsored intensive research into the physics of cooling densely packed integrated circuits. Many air and liquid cooling systems were devised and investigated, using methods such as natural and forced convection, direct air impingement, direct liquid immersion and forced convection, pool boiling, falling films, flow boiling, and liquid jet impingement. Mathematical analysis was used to predict temperature rises of components for each possible cooling system geometry.[2] IBM developed three generations of the Thermal Conduction Module (TCM) which used a water-cooled cold plate in direct thermal contact with integrated circuit packages. Each package had a thermally conductive pin pressed onto it, and helium gas surrounded chips and heat conducting pins. The design could remove up to 27 watts from a chip and up to 2000 watts per module, while maintaining chip package temperatures around 50 °C (122 °F). Systems using TCMs were the 3081 family (1980), ES/3090 (1984) and some models of the ES/9000 (1990).[2] In the IBM 3081 processor, TCMs allowed up to 2700 watts on a single printed circuit board while maintaining chip temperature at 69 °C (156 °F).[3] Thermal conduction modules using water cooling were also used in mainframe systems manufactured by other companies including Mitsubishi and Fujitsu. (quotation stop) -- Regards, Tomasz Rola -- ** A C programmer asked whether computer had Buddha's nature. ** ** As the answer, master did "rm -rif" on the programmer's home ** ** directory. And then the C programmer became enlightened... ** ** ** ** Tomasz Rola mailto:tomasz_r...@bigfoot.com ** ---------------------------------------------------------------------- For IBM-MAIN subscribe / signoff / archive access instructions, send email to lists...@listserv.ua.edu with the message: INFO IBM-MAIN
