CALL FOR PARTICIPATION
5th IEEE WORKSHOP ON
SIGNAL PROPAGATION ON INTERCONNECTS
Sponsored by the IEEE Computer Society
Test Technology Technical Council (TTTC)
May 13-16, 2001
Union Lido Park Hotel, Venice (Cavallino), Italy
http://www.tet.uni-hannover.de/SPI
During the last four years, the IEEE Workshop on Signal Propagation on
Interconnects has been developed into a forum of exchange on the latest
research results in this area. The aim of this ensuing workshop is to
report on the most recent developments in the field of interconnect
modeling, simulation and measurement on chips, boards, and packages. The
event is also meant to bring together developers and researchers from
industry and academia in order to encourage cooperation. In view of the
last years� success the committee is looking forward to the 5th IEEE
Workshop on Signal Propagation on Interconnects where world class
developers and researchers will share and discuss leading edge results in
Venice, Italy. The workshop will be held in English.
Main topics of the workshop will include, but are not limited to:
- Delta-I Noise
- Broadband Measurement Techniques and Theory
- Coupling Effects on Interconnects
- Determination of Characteristic Parameters
- Field Theory
- Ground Bounce
- Guided Waves on Interconnects
- Measurement, Modeling, and Simulation of Package Interconnects
- Non-Linear Modeling and Analysis
- Propagation Characteristics on Signal and Ground Lines
- Radiation and Interference
- Simulation Techniques for 2- and 3-dimensional Interconnect Structures
- Substrate Influence on Signal Propagation
- Interconnects and Testing
- Mixed Signal Test
- Optical Interconnects: Design and Test
Submission of abstracts:
Those who wish to contribute to the workshop should send a two page
extended summary of their paper (including figures) to the Program Chair or
the Co-Chair by January 31, 2001. The title of the paper as well as the
names and affiliations of all authors must appear on the first page of the
summary. If the paper is accepted, the summary will be reproduced, as is,
in the workshop's digest. Notification about acceptance will be given by
March 3, 2001.
Please consult our website http://www.tet.uni-hannover.de/SPI for more
detailed information about the workshop and the location. The committee is
looking forward to your participation.
Workshop Standing Committee:
Joachim P. Mucha, President, Univ. Hannover, Institut fur Theoret.
Elektrotechnik, Hannover (D), [EMAIL PROTECTED]
Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica,
Torino (I)
[EMAIL PROTECTED]
Hartmut Grabinski, Universitat Hannover, Institut fur Theoretische
Elektrotechnik, Hannover (D) [EMAIL PROTECTED]
Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa
(CAN)
[EMAIL PROTECTED]
Petra Nordholz, Infineon Technologies AG, Munchen (D)
[EMAIL PROTECTED]
Jose E. Schutt-Aine, Univ. of Illinois at Urbana-Champaign, Center for
Comp. Elm., Urbana (USA) [EMAIL PROTECTED]
Program Chair:
Flavio G. Canavero,
Politecnico di Torino,
Dipartimento di Elettronica,
Corso Duca Abruzzi 24, I-10129 Torino (Italy)
Tel. +39-011-564-4060, Fax +39-011-564-4099
e-mail [EMAIL PROTECTED]
Program Co-Chair:
Ivan A. Maio,
Politecnico di Torino,
Dipartimento di Elettronica,
Corso Duca Abruzzi 24, I-10129 Torino (Italy)
Tel. +39-011-564-4100, Fax +39-011-564-4099
e-mail [EMAIL PROTECTED]
Technical Program Committee:
W. Bandurski, Univ. Poznan (PL)
A. Cangellaris, Univ. Illinois (USA)
H. Dirks, Univ. Kiel (D)
E. Griese, Siemens C-LAB, Paderborn (D)
H.-J. John, Siemens AG, Paderborn (D)
W. John, SNI, Paderborn (D)
E. Kuh, Univ. of Calif., Berkeley (USA)
N. van der Meijs, Univ. Delft (NL)
O.A. Palusinski, Univ. Arizona, Tucson (USA)
H.J. Pfleiderer, Univ. Ulm (D)
L.T. Pileggi, Carnegie Mellon, Pittsb. (USA)
J.L. Prince, Univ. of Arizona, Tucson (USA)
K. Reiss, Univ. Karlsruhe (D)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM, Yorktown Heights (USA)
E. Sicard, INSA, Toulouse (F)
M. Swaminathan, Georgia I. Tech (USA)
R. Velazco, TIMA, Grenoble (F)
D. Williams, NIST, Boulder (USA)
T.W. Williams, Synopsys, Mount. View (USA)
Y. Zorian, Logic Vision Inc., San Jose (USA)
