Please consider the following announcement and accept our apologies in case
of multiple copies.
CALL FOR PARTICIPATION
6th IEEE WORKSHOP ON
SIGNAL PROPAGATION ON INTERCONNECTS
Sponsored by
the IEEE Computer Society - Test Technology Technical Council (TTTC)
and by
the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society
May 12-15, 2002
Convention Center "Il Ciocco," Castelvecchio Pascoli (Pisa), Italy
http://www.tet.uni-hannover.de/SPI
During the last five years, the IEEE Workshop on Signal Propagation on
Interconnects has been developed into a forum of exchange on the latest
research results in this area. The aim of this ensuing workshop is to
report on the most recent developments in the field of interconnect
modeling, simulation and measurement on chips, boards, and packages. The
event is also meant to bring together developers and researchers from
industry and academia in order to encourage cooperation. In view of the
last years success the committee is looking forward to the 6th IEEE
Workshop on Signal Propagation on Interconnects where world class
developers and researchers will share and discuss leading edge results in
Northern Tuscany, Italy. The workshop will be held in English.
Main topics of the workshop will include, but are not limited to:
- Delta-I Noise
- Broadband Measurement Techniques and Theory
- Coupling Effects on Interconnects
- Determination of Characteristic Parameters
- Field Theory
- Ground Bounce
- Guided Waves on Interconnects
- Measurement, Modeling, and Simulation of Package Interconnects
- Non-Linear Modeling and Analysis
- Propagation Characteristics on Signal and Ground Lines
- Radiation and Interference
- Simulation Techniques for 2- and 3-dimensional Interconnect Structures
- Substrate Influence on Signal Propagation
- Interconnects and Testing
- Mixed Signal Test
- Optical Interconnects: Design and Test
Submission of abstracts:
Those who wish to contribute to the workshop should send (by e-mail only) a
two page extended summary (including figures) to the Program Co-Chair by
February 3, 2002.
The title of the work as well as the names and affiliations of all Authors
must appear on the first page of the summary. Notification of acceptance
will be given by March 3, 2002. Authors whose summaries are accepted will
be requested to provide by April~12, 2002 a formatted four-page paper to be
printed in the workshop proceedings.
Please consult our website http://www.tet.uni-hannover.de/SPI for more
detailed information about the workshop and the location. The committee is
looking forward to your participation.
Workshop Standing Committee:
Joachim P. Mucha, President, Univ. Hannover, Institut fur Theoret.
Elektrotechnik, Hannover (D)
[EMAIL PROTECTED]
Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica,
Torino (I)
[EMAIL PROTECTED]
Hartmut Grabinski, Universitat Hannover, Institut fur Theoretische
Elektrotechnik, Hannover (D)
[EMAIL PROTECTED]
Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa
(CAN)
[EMAIL PROTECTED]
Jose E. Schutt-Aine, Univ. of Illinois at Urbana-Champaign, Center for
Comp. Elm., Urbana (USA)
[EMAIL PROTECTED]
Madavan Swaminathan, Georgia Institute of Technology, Atlanta (USA)
[EMAIL PROTECTED]
Program Chair:
Flavio G. Canavero,
Politecnico di Torino,
Dipartimento di Elettronica,
Corso Duca Abruzzi 24, I-10129 Torino (Italy)
Tel. +39-011-564-4060, Fax +39-011-564-4099
e-mail [EMAIL PROTECTED]
Program Co-Chair:
Ivan A. Maio,
Politecnico di Torino,
Dipartimento di Elettronica,
Corso Duca Abruzzi 24, I-10129 Torino (Italy)
Tel. +39-011-564-4100, Fax +39-011-564-4099
e-mail [EMAIL PROTECTED]
Technical Program Committee:
R. Aschenbrenner, Fraunhofer IZM, Berlin (D)
W. Bandurski, Univ. Poznan (PL)
A. Cangellaris, Univ. Illinois (USA)
H. Dirks, Univ. Kiel (D)
E. Griese, Siemens C-LAB, Paderborn (D)
H.-J. John, Siemens AG, Paderborn (D)
W. John, SNI, Paderborn (D)
E. Kuh, Univ. of Calif., Berkeley (USA)
N. van der Meijs, Univ. Delft (NL)
O.A. Palusinski, Univ. Arizona, Tucson (USA)
H.J. Pfleiderer, Univ. Ulm (D)
L.T. Pileggi, Carnegie Mellon, Pittsb. (USA)
J.L. Prince, Univ. of Arizona, Tucson (USA)
K. Reiss, Univ. Karlsruhe (D)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM, Yorktown Heights (USA)
E. Sicard, INSA, Toulouse (F)
R. Velazco, TIMA, Grenoble (F)
D. Williams, NIST, Boulder (USA)
T.W. Williams, Synopsys, Mount. View (USA)
Y. Zorian, Logic Vision Inc., San Jose (USA)
