DataCom 2015: CFP - research paper, works-in-progress, industry & workshop
track, doctoral symposium, demo & poster
2015 International Conference on Big Data Intelligence and
Computing（DataCom 2015）
http://umc.uestc.edu.cn/conference/DataCom2015/
Dec. 19th-21st, 2015, Chengdu, Sichuan, China
(IEEE/ACM/Elsevier/Springer Sponsored)
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PUBLICATION HIGHLIGHTS
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- IEEE CS proceedings
- Papers will be indexed by Scopus, EI, DBLP, etc.
- Post-conference special issues of SCI indexed journals
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IMPORTANT DATES
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Submission deadline: Sep. 15th, 2015 (Research track)
Submission deadline: Sep. 22nd, 2015 (Works-in-Progress)
Submission deadline: Sep. 29th, 2015 (Industry and workshop track)
Submission deadline: Oct. 10th, 2015 (Doctoral Symposium)
Submission deadline: Oct. 14th, 2015 (Demo/Poster)
Author Notification (Research): Oct. 8th, 2015
Author Notification (WIP/Industry/workshop/doctoral/poster): Oct. 24th, 2015
Camera Ready/registration deadline: Oct. 31, 2015
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CALL FOR PAPERS
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- Research paper
- Wild and Works-in-Progress
- Industry and workshop track
- Doctoral symposium
- Demo/Poster
Big data is a rapidly expanding research area spanning the fields of computer
science and information management, and has become a ubiquitous term in
understanding and solving complex problems in different disciplinary fields
such as engineering, applied mathematics, medicine, computational biology,
healthcare, social networks, finance, business, government, education,
transportation and telecommunications.
The goal of the 2015 International Conference on Big Data Intelligence and
Computing (DataCom 2015) is to establish an international forum for engineers
and scientists to present their ideas and experiences in the fields of Big Data
intelligence and computing. DataCom 2015 welcomes paper submissions on
innovative work from researchers in academia, industry and government
describing original research work in Big Data. Authors of selected papers will
be invited to submit an extended version (with at least 30% new material) for
review and publication in special issues of international journals. Welcome to
Chengdu, which has great weather, genuine Sichuan cuisine and many famous
tourism places, such as Jiuzhai Valley, Chengdu Giant Panda Breeding Research
Base, Emei Mountain and so on.
DataCom 2015 will be held on Dec. 19th-21st, 2015 in Chengdu, Sichuan, China.
Topics of interest include, but are not limited to:
● The 5Vs of the data landscape: volume, variety, velocity, veracity,
value.
● Big data science and foundations, analytics, visualisation and
semantics.
● Software and tools for big data management.
● Security, privacy and legal issues specific to big data.
● Big data economy, QoS and business models.
● Intelligence and scientific discovery.
● Software, hardware and algorithm co-design, high-performance
computing.
● Large-scale recommendation systems and graph analysis.
● Algorithmic, experimental, prototyping and implementation.
● Data-driven innovation, computational modelling and data integration.
● Data intensive computing theorems and technologies.
● Modelling, simulation and performance evaluation .
● Hardware and infrastructure, green data
centres/environmental-friendly perspectives.
● Computing, scheduling and resource management for sustainability.
● Complex applications in areas where massive data is generated.
Research Paper:
Full research manuscripts should explore a specific technology problem and
propose a complete solution to it, with extensive experimental results,
practical experience reports are expected to provide an in-depth exposition of
practitioner experiences and empirical studies.
WIP Paper:
Wild and Works-in-Progess (WIP) Papers are expected to present either work
currently in progress or less developed but highly innovative ideas related to
areas relevant to IOV, aiming at inspiring discussion among conference
attendees and getting people thinking about open research challenges.
Please send your submission as an email attachment in PDF to
[email protected] with the subject: “DataCom WIP Paper Submission.”
Industry presentation:
The objective of the Industry Track is to establish an efficient dialogue
between practitioners and researchers concerning the challenges, findings (both
positive and negative), encountered obstacles, and lessons learned on IOV. The
Industry Track papers and presentations will address the application of IOV
practices (which may include work on principles, techniques, tools, methods,
processes) to a specific domain or to the development of a substantial IOV
system.
Please send your submission as an email attachment in PDF to
[email protected] with the subject: “DataCom Industry Presentation
Submission.”
Doctoral Symposium:
The objective of the Doctoral Symposium is to provide constructive feedback and
guidance to doctoral students who are performing their dissertation research in
the field of IOV and to help students interact with established researchers and
practitioners. A research summary should include Student name, university,
research advisor, the problem to be addressed by your thesis, Your research
hypothesis, The expected contributions of your dissertation research, Your
proposed research approach, Summary of results to date, How you plan to
evaluate your results and a dissemination plan.
Please send your submission as an email attachment in PDF to
[email protected] with the subject: “DataCom Doctoral Symposium
Submission.”
Demo/Poster:
Submissions must describe working systems and be related to IOV. These systems
may be innovative prototype implementations or mature systems that use related
technology. The demo paper should provide adequate information on the system's
architecture, individual components, the way the system is operated, and the
way the system will be demonstrated during the conference.
Please send your submission as an email attachment in PDF to
[email protected] with the subject: “DataCom Demo/Poster Submission.”
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WORKSHOPS
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DataCom 2015 Organizing Committee invites proposals for one-day workshops
affiliated with the conference and addressing research areas related to the
conference. The workshop proceedings will be published by IEEE CS Press. Submit
workshop proposals to workshops chairs via emails (E-mail:
[email protected]).
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PAPER SUBMISSION
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Papers need to be prepared according to the IEEE format, no more than 6 pages
and submitted in PDF format via the DataCom 2015 submission site:
http://umc.uestc.edu.cn/conference/DataCom2015/DataCom_papersubmission.php
IEEE formatting information:
http://www.ieee.org/conferences_events/conferences/publishing/templates.html
For WIP/Industry/workshop/doctoral/Demo/poster tracks,
Please send your submission as an email attachment in PDF to
[email protected]
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PAPER PUBLICATION
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Accepted and presented papers will be included into the IEEE Conference
Proceedings published by IEEE CS Press. Authors of accepted papers, or at least
one of them, are requested to register and present their work at the
conference, otherwise their papers will be removed from the digital libraries
of IEEE CS after the conference.
Distinguished papers accepted and presented in DataCom 2015, after further
extensions, will be published in special issues of several SCI/EI Indexed
journals including
- IEEE Transactions on Cloud Computing
- Personal and Ubiquitous Computing (SCI, Springer)
- Computer Networks (SCI Indexed, Elsevier)
- Mobile Information Systems (SCI Indexed)
- Journal of Supercomputing (SCI Indexed, Springer)
- Computers and Electrical Engineering (SCI Indexed, Elsevier)
- Microprocessors and Microsystems (SCI Indexed, Elsevier)
- International Journal of Big Data Intelligence (DBLP, InderScience)
- International Journal of Grid and High Performance Computing (EI, Scopus, ACM
DL)
- Foundations of Computing and Decision Sciences
Please visit the DataCom 2015 website
http://umc.uestc.edu.cn/conference/DataCom2015/DataCom_specialissue.php for the
complete listing of all the journals.
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Organizing Committees
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General Chairs
Geoffrey Fox, Indiana University, USA
Yeh-Ching Chung National, Tsing Hua University, Taiwan
Beniamino Di Martino, Second University of Naples, Italy
Program Chairs
Christophe Cérin, University of Paris XIII, France
Weizhe Zhang, Harbin Institute of Technology, China
Hao Wang, Aalesund University College, Norway
Executive Chair
Xingang Liu, University of Electronic Science and Technology of China, China
Advisory Committee
Robert C. H. Hsu, Chung Hua University, Taiwan
Laurence T. Yang, St. Francis Xavier University, Canada
Irena Bojanova, University of Maryland University College, USA
Jie Li, Tsukuba University, Japan (IEEE TSCBD Chair)
Jinsong Wu, Bell Laboratories, China
Award Chair
Rajkumar Buyya, University of Melbourne, Australia
Publicity Chairs
Yunquan Zhang, Chinese Academy of Sciences, China
Anna Kobusinska, Poznan University of Technology, Poland
Xingde Jia, Texas State University, USA
International Liaison Chairs
Shawkat Ali, The University of Fiji, Fiji
Daming Wei, Tohoku University, Japan
Yang Xiang, Deakin University, Australia
Publication Chair
Xiaoming Li, University of Delaware, USA
Please visit the DataCom 2015 website
http://umc.uestc.edu.cn/conference/DataCom2015/DataCom_techcommittee.php for
the complete listing of organizing committee and TPC members.
