On Mon, 6 Dec 2010, jean-pierre charras wrote:
Pay a particular attention to a new filling zone algorithm.
I need volunteers to test this algorithm and know if it is better than the
current one (i.e. if no issue found).
New fill leaves thermal stubs between SO-package pins, that old fill did
not. In the old stub-removal code there was some fudge factor for corner
cases if I remember correctly. So maybe the new version is just more
accurate. I havent looked at the code, but the stub issue is annoying and
may need too much work to solve properly for this release. Logic to
prevent stubs is something like "no thermals to islands smaller than
minimum width squared" or so. This issue doesn't seem to violate design
specification, but definitely worsens manufacturability.
-Vesa
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