On Wed, Mar 27, 2013 at 04:38:44PM -0500, Karl Schmidt wrote: > It could take two layers to do this - One layer to mask-out the > default paste and a second layer to put in what you want. But I > don't think many are using it at all so just reversing the function > might be a simple useful fix.
You're talking about solder paste removal... having mounted some D3PAK components I tell you how I handle it (also useful for IC with big thermal pads). 1) Don't set the paste layer in the main pad properties 2) Add individual pads *only* in the paste layer for each blob of paste you actually want Even with huge components you usually don't need more than 9 blobs, it's actually quite fast to do. You could even script it... Anyway this is an extremely process dependant operation (IIRC average reduction is from 40% to 60%) since varies with stencil thickness, stencil cut method, paste grade and even reflow curve... in practice our fabricator usually says: 'put a single big pad and we adjust the stencil'. Even when the stencil layout is in the component datasheet! -- Lorenzo Marcantonio Logos Srl
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