Hi, Am 23.03.2015 um 18:56 schrieb Chris Pavlina:
> KiCad does not currently support standalone vias, and I think that would > be a necessity before a *clean* implementation of this could be done. I think these vias would be placed inside a copper pour, so there is something to "connect" them to. The notion of "generated" vias is new though (so if I change parameters for thermal relief, these vias can be deleted and recreated). I'd like to tack a feature request on top of that: thermal via generation in pads. For my last project I simply used four rectangular pads with copper on top and bottom and a hole in the middle. This works, but for library submission I'd like to be able to express this in a cleaner way (i.e. one large pad, with an attribute how much thermal power it needs to sink). Simon
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